| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed-wiring board, which can provide also a higher-density wiring and can be subjected to also a higher- density mounting in a simple process and moreover, manufactures the printed- wiring board having the highly reliable interconnection between wiring layers. SOLUTION: A laminated material of a structure, wherein conductive bumps 3' are formed at prescribed positions on a wiring pattern 4 and a synthetic resin insulating sheet 2' and a conductive metal foil 5' are arranged in order on the formed surface of these bumps 3' in a lamination manner, is compressed and the point parts of the bumps 3' are made to insert in the thickness direction of the sheet 2' to form penetrated conductor wiring parts 3, which are connected with the surface of the foil 5', and thereafter, a selective etching treatment is performed on the foil 5' and the foil 5' is formed into a conductive pattern. |
