| 摘要 |
<p>An electrostatic discharge protection device (30) is disclosed for use with a semiconductor chip package (12) where the electrostatic discharge protection device establishes electrical connection between connector pins (20) on the semiconductor chip package and ground, thereby creating a short circuit to protect the semiconductor chip package from electrostatic discharge protection device. The electrostatic discharge protection device is manually operable to engage or disengage a ground connection while remaining attached to the semiconductor chip package. The electrostatic discharge protection device is also removable from the semiconductor chip package either prior to or subsequent to mating a semiconductor chip package with a printed circuit board or other receptacle.</p> |
