| 摘要 |
<p>A ball grid array integrated circuit package (10) which has a plurality of vias (30) located within the solder pads (20) of a package substrate. The substrate supports an integrated circuit (24) which is connected to the solder pads (20) by the vias (30). Solder balls (36) used to solder the package (10) to an external printed circuit board (12) are attached to the solder pads (20) of the substrate. A solder mask plug (38) is formed within the vias (30) to prevent the solder balls (36) from wicking into the vias (30). Locating the vias (30) within the solder pads (20) optimizes the routing space of the substrate and increases the routing density of the package (10).</p> |
