High-density multilayer prepreg semiconductor power module

摘要

The copper-coated ceramic substrate (1) carries semiconductor circuit components (5,6) soldered or pressed into contact with conductive intermediate layers of paste or adhesive. The preimpregnated sheet (8) has apertures (13) of suitable size and position for acceptance of the components and direct contact between the coating (2) and copper tracks (11) of a flexible printed circuit board made of conventional polyimide foils (10,12). The insulation of the prepreg consists of a laminate of woven glass fibre and epoxy resin coated on both sides with epoxy. The thickness of the polyimide is at least 25 mu m. The cross-sectional area of the conductive tracks is matched to the requirements of current consumption.