发明名称 |
PRODUCTION OF MULTILAYER WIRINGS |
摘要 |
PURPOSE:To reduce the wire width of a top wiring layer and increase the scale of integration by using a thin conductive film not eroded by an etching solution as an underlayer film at the time of photoetching for patteming of the top wiring layer. |
申请公布号 |
JPS52149990(A) |
申请公布日期 |
1977.12.13 |
申请号 |
JP19760066556 |
申请日期 |
1976.06.09 |
申请人 |
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发明人 |
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分类号 |
H05K3/46;H01L21/768;H01L23/522;H05K3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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