发明名称 ASSEMBLING METHOD OF SEMICONDUCTOR DEVICES
摘要 PURPOSE:To achieve the reduction in material costs of external leads by providing a gold film containing a given amount of Sb on the rear of pellets and bonding said film to the gold film on the base material of external leads mainly composed of copper.
申请公布号 JPS52149972(A) 申请公布日期 1977.12.13
申请号 JP19760066547 申请日期 1976.06.09
申请人 发明人
分类号 H01L21/52;H01L21/58 主分类号 H01L21/52
代理机构 代理人
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