| 摘要 |
<p>Apparatus and a concomitant method of supporting a substrate while providing effective backside cooling for the substrate. The apparatus comprises a platen (108) having support pins (106), attached to the platen (108), for supporting a substrate (104) in a spaced apart relation to the platen (108). The support pins (106) cause a gap to be formed between the substrate (104) and the platen (108). The platen (108) contains at least one heat transfer medium supply portal (110) that passes through the platen (108) to supply a heat transfer medium to the gap between the substrate (104) and platen (108). Lastly, the apparatus contains a flow control assembly (112), located proximate the peripheral edge of the substrate (104), for controlling the flow of the heat transfer medium through the gap between the platen (108) and the substrate (104). <IMAGE></p> |
