发明名称 Modular payload arrangement
摘要 <p>A modular spacecraft structure comprises a payload structure (28) having a first mechanical interface (42). Said first mechanical interface (42) is adapted to accept heat generating hardware (40). Further provided is at least one fixed panel (34, 36), having a second mechanical interface (43). Said second mechanical interface (43) is adapted to accept said heat generating hardware (40). <IMAGE></p>
申请公布号 EP0780295(A2) 申请公布日期 1997.06.25
申请号 EP19960120417 申请日期 1996.12.18
申请人 HE HOLDINGS, INC. DBA HUGHES ELECTRONICS 发明人 CAPLIN, GLENN N.;SCHULTZ, JAMES W.;SANTOS, ROMEO, JR.;YORK, GARY M.
分类号 B64G1/10;B64G1/50;B64G1/64;(IPC1-7):B64G1/10 主分类号 B64G1/10
代理机构 代理人
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