发明名称 |
Modular payload arrangement |
摘要 |
<p>A modular spacecraft structure comprises a payload structure (28) having a first mechanical interface (42). Said first mechanical interface (42) is adapted to accept heat generating hardware (40). Further provided is at least one fixed panel (34, 36), having a second mechanical interface (43). Said second mechanical interface (43) is adapted to accept said heat generating hardware (40). <IMAGE></p> |
申请公布号 |
EP0780295(A2) |
申请公布日期 |
1997.06.25 |
申请号 |
EP19960120417 |
申请日期 |
1996.12.18 |
申请人 |
HE HOLDINGS, INC. DBA HUGHES ELECTRONICS |
发明人 |
CAPLIN, GLENN N.;SCHULTZ, JAMES W.;SANTOS, ROMEO, JR.;YORK, GARY M. |
分类号 |
B64G1/10;B64G1/50;B64G1/64;(IPC1-7):B64G1/10 |
主分类号 |
B64G1/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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