| 摘要 |
An inductor structure (30) with improved Q compatible with typical integrated circuit fabrication includes a spiral inductor (12) with a conductive plane (32) between the resistive substrate (20) of the integrated circuit and the spiral inductor (12) which reduces the power loss of the inductor. A pattern (62-64) of segments may be formed in the conductive material (32) to prevent eddy currents from flowing through the conductive plane and reducing the inductance of the spiral inductor. The Q of the inductor can be enhanced by optimizing the pattern (62-64) in which the segmented conductive plane (32) is formed. The segmented conductive plane (32) may be fabricated out of metal, polysilicon or a heavily-doped region of the substrate. <IMAGE> |
