发明名称 |
IMAGE FORMING MATERIAL, IMAGE FORMING METHOD AND PRODUCTION OF PRINTED CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To easily obtain an image of high resolution by a laser direct drawing method and to easily and accurately produce a printed circuit board having a fine pattern and non-via holes and/or via holes. SOLUTION: A light-absorbing layer is formed on a substrate and then removed by irradiation of laser light to form an image of high resolution. This method can be used for the production of a printing plate or a printed circuit board. To control the film thickness of an image, an alkali-soluble layer may be formed under the light-absorbing layer. Further, in order to improve the working environment, a transfer layer is formed facing to the light-absorbing layer to suck the removed light-absorbing layer. |
申请公布号 |
JPH09166872(A) |
申请公布日期 |
1997.06.24 |
申请号 |
JP19950341349 |
申请日期 |
1995.12.27 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
AIZAWA WAKANA;HYODO KENJI |
分类号 |
G03F7/039;B41M5/26;G03F7/20;G03F7/26;G03F7/36;H05K3/00;H05K3/06;H05K3/18 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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