Heat spreader suitable for use in semiconductor packages having different pad sizes

摘要

An improved heat spreader having a specified structure suitable for commonly used in semiconductor packages regardless of pad sizes of the packages is disclosed. The heat spreader has a pad evenly provided with a plurality of first indentations. A plurality of outward broadening openings radially extend from the pad. A plurality of second indentations are provided on a leadframe facing surface of the heat spreader at the outside of the openings, so that the second indentations surround the openings. A plurality of small coupling sections radially extend on the edge of the heat spreader at every 90 DEG angle. The small coupling sections have their downward extending projections at their distal ends. A plurality of large coupling sections diagonally extend on the edge of the heat spreader. Each of the large coupling sections has a plurality of outward extending projections.