Epoxy resin composition for sealing photosemiconductor element and photosemiconductor device sealed with the epoxy resin composition

摘要

An epoxy resin composition for sealing a photosemiconductor element includes (A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule, (B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and (C) a cure accelerator component, <IMAGE> (I) <IMAGE> wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component; and a photosemiconductor device is sealed with the epoxy resin composition.