| 摘要 |
A modular platform floor system for advantageous use at trade shows and conventions includes a plurality of interconnectable floor modules, wherein each module includes a supporting rectangular frame and a panel supported thereon, the platform having cutout, notched corners defining openings between two or more adjacently located floor modules, and plastic plugs which seat within these openings to interconnect the adjacently located modular units via downwardly depending prongs which engage the supporting frames of the modular units. Carpet pieces are secured separately to the top surfaces of the panels and to the plugs, to provide an aesthetic and comfortable surface for the floor. The plug is integrally formed, preferably of injection molded thermoplastic, to provide a unitary one piece plug for interconnecting the adjacently located floor modules. Compared to multi-piece plugs for floors of this type, an integrally formed plastic plug represents lower manufacturing costs per unit, fewer manufacturing steps, lower shipping costs due to lighter weight, lower susceptibility to loosening of the prongs, and better adherence to carpet secured thereto.
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