| 摘要 |
PROBLEM TO BE SOLVED: To enhanced adhesion of an insulation layer to a substrate by composing the substrate of a substrate part for a conductive electronic device having a conductive layer formed on a substrate, and a substrate part for insulating an electronic device having an insulating layer formed by a sol-gel method or a water glass method. SOLUTION: The substrate 1 comprises a substrate part 1a for a conductive electronic device having a conductive layer 3 formed by bonding a conductive foil onto the substrate 1 through a conductive adhesive 2, and a substrate part 1b for insulating an electronic device having a conductive layer 6 formed by bonding a conductive foil, through adhesive 5, onto an insulating layer formed by a sol-gel method or a water glass method. The substrate 1 employs a metal plate of 1-5mm thick, e.g. an aluminum plate or a copper plate, dissipating heat efficiently from an electric/electronic device and the insulating layer of 10-60μm is formed of alumina, silica, etc., on the substrate part 1b for insulating electronic device by a sol-gel method or a water glass method. This method reduces the production cost.
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