| 摘要 |
A method for forming a tamper-resistant envelope formed of a thermoplastic resin comprises two opposing panels having respective bottom and side wall edges bonded together to form a pocket therebetween. The top of the pocket is open for inserting an item into the pocket. Each panel has an edge portion adjacent the opening. A bead of pressure-sensitive adhesive is applied adjacent the edge portions, and the bead is heat-seal bonded to the thermoplastic edge portion. The edge portions can be brought together to bring the adhesive beads into contact to close the opening. By heat-seal bonding the adhesive beads to the thermoplastic edge portions, the pressure-sensitive adhesive is less susceptible to being opened by supercooling.
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