发明名称 RESIN SEALING DIE FOR SEMICONDUCTOR
摘要 PROBLEM TO BE SOLVED: To perform the sealing operation continuously and stably without generating any burr which causes trouble of the die in the following steps. SOLUTION: A channel 9 longer than a hole 23 in a lead frame 22 and having an opening area substantially equal to or larger than that of a gate 2a is provided oppositely to the part 4 of an upper die for pooling a fused resin being fed through the hole 23 in lead frame 22 on the rising step 8 of runner of a lower die. The channel is constricted with respect to the runner or surface treatment for facilitating the releasing of die is performed, as required, so that a resin burr 25 at the pool is not moved in the post-process and the remaining resin 26a can be removed easily.
申请公布号 JPH09167781(A) 申请公布日期 1997.06.24
申请号 JP19950326970 申请日期 1995.12.15
申请人 NEC CORP 发明人 AZUMA KOSUKE
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/26
代理机构 代理人
主权项
地址