发明名称 Sintered aluminum nitride and circuit substrate using sintered aluminum nitride
摘要 Disclosed is a sintered aluminum nitride composition and a circuit substrate for use in semiconductor device. The sintered aluminum nitride composition comprises: aluminum nitride; a first component given by a compound containing an element which is selected from the group consisting of alkaline earth elements and group IIIa elements of the periodic table; a second component made of either a simple silicon or a silicon-containig compound; and a third component made of either a simple manganese or a manganese-containing compound. The circuit substrate has an insulating layer which is compoesd of the above-described sintered aluminum nitride composition, and an electrically conductive layer containing an electrically conductive material and the same components as those of the insulating layer.
申请公布号 US5641718(A) 申请公布日期 1997.06.24
申请号 US19950521475 申请日期 1995.08.30
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HORIGUCHI, AKIHIRO;OH-ISHI, KATSUYOSHI;KASORI, MITSUO;SUMINO, HIROYASU;UENO, FUMIO;MONMA, JUN;KIMURA, KAZUO
分类号 C04B35/581;C04B41/51;C04B41/88;H01L23/15;H05K1/03;(IPC1-7):C04B35/58;C04B35/03;B32B7/00 主分类号 C04B35/581
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