| 摘要 |
PROBLEM TO BE SOLVED: To realize flip-chip bonding without using any flux. SOLUTION: At the time of flip-chip bonding an element to an element or a substrate, bumps for at least one element 1 are formed such that bumps 4 of tow melting point metal are provided on the underlying metal layer 2 for the element 1 and applied with a high melting point metal layer 5 and then the bump 4 is heated while controlling the melting point to scatter the metal layer 5 granularly over the surface of bump 4. The bump 4 is pressed against the opposing bump of other element or a pad on an opposing substrate and the oxide on the surface of bump is broken by means of the metal layer 5 before the bump is heated. |
