| 摘要 |
PROBLEM TO BE SOLVED: To obtain an integrated circuit package which is capable of dissipating heat energy released from an integrated circuit operating on a high frequency by a method wherein the integrated circuit package is equipped with a conductive layer which comprises a signal layer, a first voltage layer, and a second voltage layer and a bonding wire prescribed in inductancea, where a specific decoupling capacitance is given between the above voltage layers. SOLUTION: A conductive layer is equipped with a first voltage layer 28 which sends a first reference voltage signal to a chip 22, a second voltage layer 30 which applies a second reference voltage signal to the chip 22, and a signal layer 32 which gives the chip 22 access to data signals. The second voltage layer 30 is closely linked to the first voltage layer 28 so as to give a decoupling capacitance 0.05nF/cm<2> of a significant level. The bonding wire 44 is smaller in inductance than 1nH or so but larger than 0.25nH or so. Therefore, an integrated circuit package of this constitution is suitable for an IC chip which operates on high frequencies and is possessed of a large number of inputs/outputs and capable of dissipating heat well. |
