| 摘要 |
<p>PROBLEM TO BE SOLVED: To realize cutting with high dimensional accuracy and low production cost by developing a board cutting crack through a scribed groove in the direction of the thickness of a board by a method wherein both a mechanical cracking treatment and a chemical cracking treatment are performed in combination with each other. SOLUTION: On a ceramic board 1 after sintering, a scribing groove 2 having the width of about 50μm is engraved wedgewise with a diamond blade. Further, the rear surface opposite to the scribed groove 2 of the board is supported by a supporting axis 4. Pressing plates 5, which are applied on the front surface of the board at right and left about the supporting axis 4, are pressed downwards. In addition, during the execution of the above-mentioned mechanical cracking treatment, water is blasted from a nozzle 6 against the scribed groove 2. The water is infiltrated in the crack developed in the scribed groove 2, resulting in enlarging the crack by chemical reaction. The phenomenon that the water infiltrated in the crack develops chemical reaction is continued. As a result, a cutting edge turned to be normal to the board 1 or runs in the direction of the thickness of the board 1, resulting in realizing the cutting of the board 1 with high dimensional accuracy.</p> |
