TACKY FILM FOR PROTECTING SEMICONDUCTOR WAFER AND SURFACE PROTECTION USING THE SAME

摘要

PROBLEM TO BE SOLVED: To prepare an inexpensive tacky film for protection of a semiconductor wafer, capable of readily being released from a semiconductor wafer only by heating and provide a surface protection method using the film. SOLUTION: This film comprises a tacky agent and a heat-shrinkable plastic film substrate. In the film, 20-80% monomer constituting the tacky agent is a comb-shaped polymer having an >=8C side chain and an aliphatic bifunctional isocyanate is used as the crosslinking agent and its adhesive force to silicon wafer is >=50gf/25mm at a temp. near the melting point of the tacky agent and <=20gf/25mm at 80 deg.C. The tacky film is attached to an adherend at a temperature not lower than a melting point of the tacky agent constituting the film and the attached material is cut every small portion of the adherend at a temperature lower by 10 deg.C or higher by 5 deg.C than the melting point and the film is contracted by heating the film to 80-150 deg.C to release the film from the adherend.