发明名称 |
Method for minimizing the clogging of a cooling zone heat exchanger in a reflow solder apparatus |
摘要 |
A method for minimizing the clogging of a cooling zone heat exchanger of a reflow solder apparatus that includes the steps of: removing a gas/flux mixture from an exhaust zone (20) that is located adjacent a heated zone and/or a cooling zone; conducting the gas/flux mixture to and through a first filter chamber (22), conducting the filtered gas from the filter chamber (22) through a low pressure portion of a blower housing of a cooling zone (16), then subsequently to and through a high pressure portion (44) of the cooling zone that includes a collection tray (38), a mesh filter (48), a heat exchanger (46) and at least one perforated plate (50). The heat exchanger is thermostatically controlled at a preset tempering temperature that minimizes the collection of flux on its exterior surfaces while allowing a solder joint of an article to solidify.
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申请公布号 |
US5641341(A) |
申请公布日期 |
1997.06.24 |
申请号 |
US19960599941 |
申请日期 |
1996.02.14 |
申请人 |
HELLER INDUSTRIES |
发明人 |
HELLER, DAVID;NEVILLE, JAMES;GRIFFIN, PETER J. |
分类号 |
B23K1/20;(IPC1-7):B01D29/56 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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