| 摘要 |
PROBLEM TO BE SOLVED: To fix metal panels of the surface and the rear face on a resin frame without using an adhesive and simultaneously applying electric power to each of the metal panels. SOLUTION: In an IC card 1 comprising an electric circuit base 3 into which given electronic parts 4 and the like are incorporated, a connector 5 connected with one end side of the electric circuit base, a frame 2 constituting an outer frame of the card, and a pair of panels 6 and 7 covering the surface and the rear face of the card, a plurality of flaps 6c and protrusions 7c to be engaged with are provided on the side edge sections of respective metal panels 6 and 7. On the other hand, a plurality of slits for force fitting respective protrusions 7c of the lower side metal panel 7 are formed on the frame 2, and the protrusions 7c are forced into respective slits, and the corresponding flaps 6c of the upper side metal panel 6 are engaged with the protrusions 7c in the state of applying the flexible force of the metal panels. |
