| 摘要 |
<p>PROBLEM TO BE SOLVED: To paste a film on an Al board provided with a conductive path to form a viahole which brings an upper layer into contact with a lower layer and to plate the inside of the viahole well. SOLUTION: A Cu sheet 34 is pasted on the rear of an Al board 30 before the inside of a viahole is plated, and then electroless plating and electroplating are successively carried out. Electroless plating solution shows a high activity, but the Al board 30 is hardly eluted because the Cu sheet 34 is pasted on it, furthermore the Cu sheet 34 is plated with Cu while plating is carried out, so that Cu is restrained from separating, and plating solution is restrained from deteriorating.</p> |
