发明名称 LEAD WIRE CUTTER FOR ELECTRONIC DEVICE
摘要 A cutting apparatus for cutting a lead wire used for PCB(Printed Circuit Board) is disclosed. The cutter comprises a left cutting plate(10) having cutter and a right cutting plate(11) having cutter formed opposite to the left cutting plate(10), thereby cutting the lead wire of the electronic devices to the structure of square pyramid-shaped. The cutter has a half square pyramid shaped receiving groove and V-shaped cutting blade.
申请公布号 KR970010116(B1) 申请公布日期 1997.06.21
申请号 KR19900014378 申请日期 1990.09.12
申请人 SAMSUNG ELECTRONICS CO.,LTD 发明人 KIM, JONG-HYUN
分类号 H05K13/00;(IPC1-7):H05K13/00 主分类号 H05K13/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利