发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 There are provided a printed circuit board and manufacturing method of it. The method comprises the following steps of: forming a predetermined circuit pattern and preparing printing original board, placing the printing original board on resin or metal substrate, forming circuit by directly screen-printing conductive resin and thermosetting it with conductive resin, and pasting corrosion-resistant protection film on the thermosetted conductive resin. Accordingly, the printed circuit board using conductive resin can be used in all kinds of electronic equipment.
申请公布号 KR970010109(B1) 申请公布日期 1997.06.21
申请号 KR19940013967 申请日期 1994.06.21
申请人 SAMSUNG ELECTRO-MECHANICS CO.,LTD 发明人 CHOE, CHUN
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
代理机构 代理人
主权项
地址