| 摘要 |
PROBLEM TO BE SOLVED: To provide a very reliable lead frame which has no peel-off not only in manufacturing but also in service. SOLUTION: This lead frame consists of a main body and a radiating board 3. The main body of the lead frame has a semiconductor device mounting section 11, a plurality of inner leads 12 which are radially located so as to surround the semiconductor device mounting section 11, and a plurality of outer leads which are connected to the inner leads respectively. The radiating board 3, being stretched from the semiconductor device mounting section 11 to the ends of the inner leads 12 which are located in the periphery of the section 11, is tightly adhered to a rear face of the main body of the lead frame via an insulating tape 2. At that time, the radiating board 3 has an opening at a place corresponding to a space between the semiconductor device mounting section 11 of the main body of the lead frame and the ends of the inner leads 12. |
