| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of heat on a metal fine wire due to an overcurrent and smoking and ignition on a semiconductor device while a wire bonding operation is being conducted using a metal fine wire. SOLUTION: A small diameter part 5a is provided on a part of a metal fine wire 5 which connects a semiconductor chip 3 and an external connection terminal 1B. When an overcurrent is allowed to flow through the semiconductor chip 3, the metal fine wire 5 is cut by fusing at the small diameter part 5a, internal heat generation is prevented and the smoke and ignition caused by the overheating of resin can also be prevented. The small diameter part 5a can be formed at an arbitrary place of the metal fine wire 5 when a wire bonding operation is conducted, the use of a metal wire of different diameters and its bonding are unnecessitated, and the common use of part and the bonding operation can be facilitated. |
