发明名称 WIRE BONDING CAPILLARY
摘要 PROBLEM TO BE SOLVED: To provide a high-density ceramic wire bonding capillary to be mounted on a wire bonder to weld a wire to a bonding face with an ultrasonic vibration, where the capillary has a high mechanical strength at the tip enough to transmit the vibration. SOLUTION: A welding part 54, focusing part 53 and body are unified and sintered in a mold to form the outside taper of the welding part 54 at a first angle A1, that of the converging part 53 at a second angle A2, the tape of a through-hole 42 at a third angle A3 equal or less than the second angle. The second angle is 30deg. and the first and third angles are each 10deg.
申请公布号 JPH09162223(A) 申请公布日期 1997.06.20
申请号 JP19950320664 申请日期 1995.12.08
申请人 CAN ELECTRON:KK;SUMOOLE PRECISION TSUURUZU 发明人 KENESU UEIN ERETSUTO;SUZUKI MASAO
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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