| 摘要 |
PROBLEM TO BE SOLVED: To secure a highly reliable sealing structure at low cost by putting a cover containing the high-temperature solder on its entire surface onto a chip carrier where a surface acoustic wave element is mounted and then heating and melting the solder. SOLUTION: A chip carrier 1 consists of the laminated ceramic and has a tungsten metalized part touching a cover 3 where the gold or solder plating is applied. A surface acoustic wave element 2 is put into the carrier 1 via the die bonding or wire bonding, and the side of the cover 3 where a high- temperature solder 4 is entirely applied is turned to the carrier 1. The cover 3 is put on the carrier 1, and the solder 4 is heated and melted by the high frequency induction. Thus the cover 3 is adhered onto the carrier 1 in an airtight sealing state. The solder 4 uses an alloy of lead, tin and silver and has a melting point higher than >=280 deg.C together with its layer thickness of about 10 to 100μm.
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