SUBSTRATE PROCESSING DEVICE AND SUBSTRATE TRANSFER DEVICE USED THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing device which can be enhanced in throughput by a method wherein at least one of two processing sections is efficiently adjusted in substrate support height for the replacement and transfer of a substrate. SOLUTION: The support pins 22 of a substrate cooling part CP are made to push up a substrate W to a first standby position H2 by driving a second air cylinder 32 from a substrate processing position H1 where the substrate W is cooled. In this state, a third air cylinder 33 is driven to push up the substrate W from the first standby position H2 to a second standby position H3 separate from the first standby position H2 by a distance twice as long as a prescribed vertical interval between the two arms of a substrate transfer section. The support pins 22 are adjusted in height to the first standby position H2 and the second standby position H3 respectively, whereby a gap induced at the replacement of the arms in position can be canceled.