| 摘要 |
PROBLEM TO BE SOLVED: To fill up narrow high-aspect ratio apertures to form electric contacts, without forming voids in a final deposit by comprising an aperture lining composed of a carrier layer and sputter conductor to be reflowed to fill the apertures. SOLUTION: Prior to deposition of a conductor, a carrier layer 100 is formed on the walls of apertures 113 of a high aspect ratio exceeding 1:1, the flow or moving of a depositing material for filling the apertures 113 is raised to deposit a conductor esp. Al in the apertures 113 of a thin film layer or substrate. Thus, if using the carrier layer 100, contacts 118, vias, etc., can be formed by depositing an aperture filling material by the conventional sputtering techonology and flowing it into the apertures 113 having an aspect ratio over 1:1. |
