| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a highly reliable resin encapsulated electronic product without corrosion when it is used for a long period of time. SOLUTION: First, electronic parts 2 and 3 and a lead terminal 4 are mounted on a substrate 1. Then, the substrate 1 is arranged in a decompressed atmosphere, and the flux residue on the substrate is vaporized. Also, the flux residue on the substrate 1 is flown away by projecting plasma on the substrate 1. After the performance of said residue removing process, a package layer 12, which seals the circumference of the entire substrate 1 including the electronic parts 2 and 3 excluding a part of the lead terminal 4 by covering with thermoplastic resin material. Consequently, as no flux residue is present on the substrate 1, no corrosion is generated due to the infiltrated moisture. |
