| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device that reduces plug loss and maintain throughput, in which a wafer being transferred from a first reactor to a second reactor is introduced to a third chamber provided with cooling gas nozzles for cooling the wafer rotated on a holder. SOLUTION: A wafer holder 26, on which a wafer being transferred from a first reactor to a second reactor is temporarily placed for correction of its position, is located under a plate 24 that has holes 25 for diffusing cooling gas such as oxygen, nitrogen, air, argon or helium. The holder 26 is provided with a drive means 29 so that it can be rotated. According to this constitution, a wafer subjected to film deposition is sufficiently cooled in a reduced time, and it is possible to improve the reliability of film deposition and etching, and throughput. |
