| 摘要 |
PROBLEM TO BE SOLVED: To precisely control the region on a substrate covered with bare chip covering resin, and to provide a highly integrated substrate where the range of sealing resin is precisely limited. SOLUTION: The semiconductor bare chip 3 bonded on the surface 51 of a substrate 5 is covered with resin 6. At this time, a bank printing process, with which a double bank, consisting of at least an inner bank 1 and an outer bank 2 protruding from the surface 51, is formed by printing on the circumference of the surface part 50 of the substrate 5 where the bare chip 3 is connected, and a process, in which fluid resin 6 is fed to the region at least surrounded by the inner bank, the resin is cured in the state that the bare chip is covered with the resin and the bare chip 3 is covered with the cured resin, are conducted. The double banks 1 and 2 are formed by printing in a precise manner, and as the flow out of the resin 6 can be effectively prevented, it is suitable for high density mounting. The covering range of the resin can be visually confirmed easily. |
