| 摘要 |
PROBLEM TO BE SOLVED: To make airtight sealing of a package for a semiconductor device by preventing cracks in an insulating substrate. SOLUTION: This package consists of an insulating substrate 1, which has a mounting section 1a for mounting a semiconductor device 3 on its upper face and a radiator 9 joined to its lower face via brazing material 10, and a cover 2. In the inside of the package, a space for housing the semiconductor device 3 is formed. The difference in thermal expansion between the insulating substrate 1 and the radiator 9 is 10×10<-6> / deg.C or above. The insulating substrate 1 and the radiator 9 are joined to each other, with frame-like unjoined regions 10a formed in a part of a region between the substrate 1 and the radiator 9 which is outside a region that faces the mounting section 1a where the semiconductor device 3 is mounted.
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