发明名称 TANTALUM SOLID ELECTROLYTIC CHIP CAPACITOR
摘要 PROBLEM TO BE SOLVED: To reduce the breakdown voltage of a tantalum solid electrolytic chip capacitor and the defective leakage current of the capacitor by a method wherein a spacer, which is installed on the joint of an anode lead-out wire in a porous pellet, is constituted of a porous PTFE, FEP or PEA having an air permeability. SOLUTION: An anode lead-out wire 1 is buried in tantalum metal fine powder and a press-compressed pellet is sintered to form into a porous pellet 2. A spacer 3 is installed on the joint of the wire 1 for preventing a stock solution at the time of formation of a cathode from leaking in the joint of the wire 1 in this pellet 2 more than requires. As the material for this spacer 3, an ethylene tetrafluoride resin, which has a large contact angle to the stock solution at the time of formation of the cathode, has an elasticity and has a plurality of holes of 0.1 to 3μm or thereabouts existing therein, a propylene tetrafluoride- hexafluoride copolyer resin or an etyle tetrafluoride-perfuroloalkyl vinylether copolymer resin is used. Thereby, the stock solution at the time of formation of the cathode can be prevented from creeping up on the wire 1.
申请公布号 JPH09162080(A) 申请公布日期 1997.06.20
申请号 JP19950344697 申请日期 1995.12.07
申请人 HITACHI AIC INC 发明人 NAKAMURA KOSUKE
分类号 H01G9/012;(IPC1-7):H01G9/012 主分类号 H01G9/012
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