| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a small chip-shaped resistor allowing wire bonding and also to provide a method for fabricating the resistor. SOLUTION: A substrate of alumina-sintered material having chip bases 1 vertically and horizontally divided by dividing grooves is formed on its front face with first and second electrodes 2 and 3 spaced from each other and on its rear face with a third electrode 4. Formed on the substrate as crossed between the first and second electrodes 2 and 3 is a resistor film 5, on which an inorganic protective film 6 of glass is formed. thereafter a cutting groove 7 is made in the resistor film 5 to adjust its resistance value. An upper face of an area of the first electrode 2 not covered with the inorganic protective film 6 is activated. A protective film 8 of heat-resistive epoxy resin is formed to cover the inorganic protective film 6 on the substrate, and the activated first electrode 2 is electrolessly plated to form an end electrode 9 thereon. The substrate is divided into strip-shaped pieces, an end face electrode 10 is formed across the second and third electrodes 3 and 4 in each divided strip, and then each divided strip is separated along its dividing grooves into chip resistors 12.</p> |
