| 摘要 |
<p>In a semiconductor package provided with a multilayered circuit formed by the so-called build-up system. A semiconductor chip is firmly fixed. The yield and the reliability such as of the durability of a semiconductor device is improved. The semiconductor package is provided with an insulating core substrate (10). On one side of the substrate (10), a semiconductor chip mounting area (20) where semiconductor chips (14) are mounted is provided and a wiring pattern (12) composed of metallic foil is formed. One end of the pattern (12) is extended into the area (20) and layers having thin film wiring patterns (22) connected to the pattern (12) are formed through thin film insulating layers (18) over the area surrounding the chip mounting area (20). The chip mounting area (20) is in a recess defined by the pattern (22) and the insulating layers (18).</p> |
