| 摘要 |
PCT No. PCT/SE95/01233 Sec. 371 Date Jul. 14, 1997 Sec. 102(e) Date Jul. 14, 1997 PCT Filed Oct. 19, 1995 PCT Pub. No. WO96/13069 PCT Pub. Date May 2, 1996In encapsulating an optocomponent with a plastics material, an MT-connector compatible interface is obtained having bores for guide pins in the wall of the capsule and optical connection surfaces. These bores are obtained from mold cavity guide pins that are used for aligning the optocomponent in a mold cavity in a mold in the molding operation of the encapsulating material on top of the component. In order to achieve a good accuracy in the positioning of the component during the molding operation, the mold guide pins are as short as possible and end directly behind the component where they are supported by projections extending from each mold half. Thus, cavities are created extending straight through the capsule behind the component. The cavities allow that the guide pin bores are cleansed and that material residues are removed after the molding operation. Further, the cavities can be used for spring clamps for retaining the optocomponent capsule at an optical connector having a similar interface. The clamps can then have tongues that are inserted in the cavities and that, in addition, can be provided with holes through which the guide pins can be pushed to safeguard the clamps against being lost. |
