Connection contacts test method for flip chip during mfr.

摘要

The method uses a semiconductor chip arranged reversed for connections on a substrate (3), also a head radiation production unit (4) radiating the unfinished chip (1). The temperature distribution produced by a semiconductor laser (4) is measured by a IR camera system and the results passed to a computer (13). An image processing unit with a monitor (11) working in conjunction with the computer establishes the quality of a connection contact section, based on the temperature distribution on the surface of the chip due to the radiated heat and data concerning the arrangement of the connections on the semiconductor chip.