HEAT SINK OF SEMICONDUCTOR PACKAGE,申请号KR19940019006U-传众专利搜索

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发明名称	HEAT SINK OF SEMICONDUCTOR PACKAGE
摘要
申请公布号	KR970006162(Y1)	申请公布日期	1997.06.19
申请号	KR19940019006U	申请日期	1994.07.28
申请人	ANAM INDUSTRY CO.,LTD	发明人	SHIN, WON-SUN;DO, BYUNG-TAE
分类号	H05K7/20;(IPC1-7):H05K7/20	主分类号	H05K7/20
代理机构		代理人
主权项
地址

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