A method of forming a contact hole in a semiconductor device.,申请号GB19960026111-传众专利搜索

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发明名称	A method of forming a contact hole in a semiconductor device.
摘要
申请公布号	GB2308232(A)	申请公布日期	1997.06.18
申请号	GB19960026111	申请日期	1996.12.16
申请人	* HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.	发明人	BYUNG SEOK * LEE;EI SAM * JEONG;IL SEOK * SONG;HAE JUNG * LEE
分类号	H01L21/302;H01L21/3065;H01L21/311;H01L21/3213;H01L21/768;H01L21/8242;H01L27/108;(IPC1-7):H01L21/311	主分类号	H01L21/302
代理机构		代理人
主权项
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