| 摘要 |
The invention relates to a method for monitoring the paste printing process in the setting and soldering of a circuit board. In the paste printing process, solder paste (5) is spread on the circuit board (4) at the surface mounted devices to be set or at the corresponding solder pads (7) of the connecting pins. According to the invention, at least one paste test pattern (9) is arranged on the circuit board (4), which test pattern consists of a number of test elements (91, 92, 93, 94), shaped like geometrical plane figures on the surface of the circuit board, and which test elements have varying degrees of difficulty in view of the printing process. <IMAGE> |
