| 摘要 |
876,744. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. April 3, 1958 [April 8, 1957], No. 10858/58. Drawings to Specification. Class 37. In a method of encapsulating semi-conductor devices to include a predetermined amount of water vapour inside the envelope, the semiconductor devices are stored, without their envelopes, in a dry space at a low temperature, e.g. - 20‹ C., and subsequently transferred to a second space maintained at a higher temperature, e.g. +20‹ C., and a constant relative humidity, e.g. 20%, whereupon moisture condenses on them and they are sealed in vacuum tight envelopes, e.g. by cementing or coldwelding so as not to disturb the temperature conditions in the second space. |
