发明名称
摘要 A contacting structure with respect to a spherical bump in which the spherical bump is to be contacted with a contact pin, the contact pin includes a contacting portion supported by a resilient support element, and the contacting portion is arranged in opposite relation to that part of a spherical surface of the spherical bump other than a lower-most point thereof. The contacting portion has a projection capable of pressing into the spherical surface of the spherical bump, and also has a pressure receiving surface for setting an amount by which the projection presses into the spherical surface.
申请公布号 JP2620525(B2) 申请公布日期 1997.06.18
申请号 JP19940240601 申请日期 1994.09.08
申请人 发明人
分类号 H01R13/11;G01R1/04;G01R1/067;G01R1/073;H01L23/32;H01R11/18;H01R13/04;H01R13/115;H01R33/76;H05K7/10;(IPC1-7):H01R33/76 主分类号 H01R13/11
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