Method and apparatus for treatment of semiconductor material

摘要

The method employs a microcontroller (8) programmed to operate each of an array of nozzles (2) through which a cleaning fluid (5) is directed from a reservoir (4) at the working surface (1) of the grinding tool. Each nozzle contains a transducer (6) made e.g. from tantalum or piezoceramic material and generating ultrasound at a different frequency. The transducers are excited by oscillators (7) of various intensities with links to the microcontroller, which also varies the output of cleaning fluid through the valve supplying each nozzle from the reservoir.