| 摘要 |
PROBLEM TO BE SOLVED: To improve the flatness precision of works by oscillating the works in the direction of changing their distances from the center of a surface plate while rotating themselves in the same direction and at the same rotating number as that of the surface plate after pushing the works against the surface plate being rotated for polishing. SOLUTION: Works 2 such as semiconductor wafers are held by holders, arranged in places on a surface plate 1 rotated by a motor and then pushed against the surface plate with desired force for polishing. In this case, the works 2 are oscillated in the directions of changing their distances from the center of the surface plate while rotating themselves in the same direction and at the same rotating number as that of the surface plate 1, and the rotating numbers of the surface plate 1 and the works 2 are increased/decreased in inverse proportion to the distances of the works 2 from the center O of the surface plate. That is, if the rotating number of the surface plate at any positions of the works 2 is Nx , a distance from the center O of the surface plate is Rx and the rotating number of the surface plate at the oscillation inside end W1 is N, the rotating number of the surface plate 1 is changed in accordance with Nx =(R1 /Rx ).N. |
