| 摘要 |
PROBLEM TO BE SOLVED: To provide a means which materializes space saving and carrying at a high speed in regard to wafer carrying. SOLUTION: The moving position to this side of a wafer 1 rested over a holder 2 is made to be located at the rotation center 12 of a driving shaft 5, and movement to the aforesaid position can be performed by elastically deforming a leaf spring 4 combining the holder 2 with the driving shaft. Therefor, since the wafer 1 can be located at its rotation center 12, a driving system and the wafer 1 are to be located above and below, and its setting space can thereby be made small. Besides, since centrifugal force acting on the wafer 1 becomes almost zero at the time of its high speed rotation, its rotational movement can thereby be performed at a high speed. |
