| 摘要 |
PROBLEM TO BE SOLVED: To make a grinder small and light weight and capable of high speed grinding by forming the grinder with a wafer rotating surface plate to perform rotation and oscillation, as required, and a grinding surface plate on which an abrasive cloth with the diameter being smaller than the diameter of a wafer to be fixed to the wafer rotating surface plate is stuck. SOLUTION: In wafer treatment during manufacturing LSIs or the like, a wafer 1 is fixed to a wafer rotating surface plate 2 and grinding liquid is dropped from a grinding liquid supply nozzle 8 onto the surface of the wafer 1 which is being rotated. A abrasive cloth 5 stuck on the grinding surface plate 6 is pushed against the wafer 1 and then the grinding surface plate 6 is rotated and moved forward and backward to flatten the wafer 1. In this case, by forming the abrasive cloth 5 and the grinding surface plate 6 into disc shape with the diameter being smaller than the diameter of the wafer 1, a grinder is made small and light so that a continuous wafer treatment device for which a thin film forming device and a wafer surface treatment device for the surface treatment of the wafer 1 after ground are connected together may be easily constructed. |
